Method for correcting measurements in the manufacture of integrated circuits and associated apparatuses

A method of metrology comprising:

• obtaining, using a plurality of measurement settings, first measurement data relating to measurement of a first structure and second measurement data relating to measurement of a second structure, said first structure and second structure having a difference in an imposed bias between them;
• determining a first relationship between said first measurement data and said measurement setting and a second relationship between said second measurement data and said measurement setting;
• correcting said first measurement data and/or second measurement data to amend the first relationship with respect to the second relationship such that they have a common measurement setting for a particular measurement value;
• and
• inferring a profile parameter value based on the corrected first measurement data and/or second measurement data.

A non-transitory computer readable medium having instructions thereon, the instructions when executed by a computer, causing operations comprising:

• obtaining, using a plurality of measurement settings, first measurement data relating to measurement of a first structure and second measurement data relating to measurement of a second structure, said first structure and second structure having a difference in an imposed bias between them;
• determining a first relationship between said first measurement data and said measurement setting and a second relationship between said second measurement data and said measurement setting;
• correcting said first measurement data and/or second measurement data to amend the first relationship with respect to the second relationship such that they have a common measurement setting for a particular measurement value;
• and
• inferring a profile parameter value based on the corrected first measurement data and/or second measurement data.

A metrology device comprising:

• a memory storing a set of instructions;
• and
• one or more processors configured to execute the set of instructions to cause the metrology device to perform operations comprising:
• obtaining, using a plurality of measurement settings, first measurement data relating to measurement of a first structure and second measurement data relating to measurement of a second structure, said first structure and second structure having a difference in an imposed bias between them;
• determining a first relationship between said first measurement data and said measurement setting and a second relationship between said second measurement data and said measurement setting;
• correcting said first measurement data and/or second measurement data to amend the first relationship with respect to the second relationship such that they have a common measurement setting for a particular measurement value;
• and
• inferring a profile parameter value based on the corrected first measurement data and/or second measurement data.