Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board

Abstract

A photosensitive resin composition according to the present disclosure contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a sensitizer, in which the binder polymer has a first structural unit derived from acrylic acid, a second structural unit derived from styrene or a styrene derivative, and a third structural unit derived from a (meth)acrylate compound, and based on the total mass of the structural units derived from the polymerizable monomers constituting the binder polymer, the content of the first structural unit is 9% by mass or more and 25% by mass or less, the content of the second structural unit is 61% by mass or more, and the content of the third structural unit is 1% by mass or more and 20% by mass or less.

Dependencies are inferred from the claim text.