US 2026/0287832 A1 · PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

Abstract

Disclosed is a packaging structure and a manufacturing method thereof, including: stacking an optical coupler covering an optical coupling region on a side surface of a first semiconductor chip where the optical coupling region is disposed, wherein the optical coupler is configured to change the propagation direction of light and has a focusing effect, capable of coupling incident light to a corresponding optical coupling interface without insertion loss. This not only resolves the conflict between the requirements for coupling space and physical protection in a 3D stacked packaging structure but also achieves a higher optical alignment tolerance, which is beneficial for improving the operational efficiency of the surface coupling process and reducing coupling loss under the same alignment mismatch.

Claims22

Dependent claims

A packaging structure, comprising:

a first semiconductor chip, wherein the first semiconductor chip comprises a first surface and a second surface opposite each other, an optical coupling region is disposed on the first surface or the second surface, and an optical coupling interface is provided in the optical coupling region;
and
an optical coupler, wherein the optical coupler is fixed on a side surface of the first semiconductor chip comprising the optical coupling region and correspondingly covers the optical coupling region, and the optical coupler corrects external input light by modulating a distance between the optical coupler and the optical coupling interface to couple the external input light to the corresponding optical coupling interface.

A packaging structure manufacturing method, the method comprising:

providing a semiconductor wafer, wherein the semiconductor wafer comprises a plurality of first semiconductor chips, each first semiconductor chip comprises a first surface and a second surface opposite each other, an optical coupling region is disposed on the first surface or the second surface, and an optical coupling interface is provided in the optical coupling region;
for each first semiconductor chip, providing an optical coupler corresponding to the first semiconductor chip, disposing the optical coupler on a side surface of the first semiconductor chip comprising the optical coupling region and correspondingly covering the optical coupling region, wherein the optical coupler corrects external input light by modulating a distance between the optical coupler and the optical coupling interface to couple the external input light to the corresponding optical coupling interface.

Dependencies are inferred from the claim text.

Packaging structure and manufacturing method thereof

Life of this patent

Packaging structure and manufacturing method thereof

Life of this patent

Abstract

Claims22