Semiconductor package structure and method of fabricating the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorFeng-Wei KUO
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Abstract
A semiconductor package is provided. The semiconductor package includes a photonic package that includes an electronic die and a photonic die bonded to each other. The photonic die includes a plurality of waveguides, each laterally surrounded by a respective dielectric layer, and a first redistribution structure disposed over the waveguides and the dielectric layers. At least one of the waveguides includes a meandering portion, the meandering portion includes two straight segments and a bend segment with a gradual curvature.
Claims20
A semiconductor package, comprising:
- a package structure including a photonic die comprising:
- a plurality of dielectric layers;
- a plurality of waveguides, each embedded in a respective dielectric layer of the dielectric layers;
- and
- a first redistribution structure disposed over the waveguides and the dielectric layers, wherein at least one of the waveguides has a meandering shape and includes two straight segments and a bend segment connected with the two straight segments, and the bend segment is in a semi-elliptical arc shape with a semi-minor axis and a semi-major axis.
A semiconductor package, comprising:
- a circuit substrate;
- and
- a package structure bonded to the circuit substrate, the package structure including a photonic die, wherein a waveguide in the photonic die includes a pair of parallel line portions and an optimal bend portion connecting the pair of parallel line portions, the optimal bend portion has a semi-minor axis and a semi-major axis, and the optimal bend portion is of a semi-elliptical arc shape.
A method for forming a semiconductor package, comprising:
- forming a package structure including forming a photonic die;
- and
- bonding the package structure to a circuit substrate, the package structure being electrically connected to the circuit substrate, wherein forming the photonic die comprises forming a plurality of waveguides and a plurality of dielectric layers, each of the waveguides is embedded in a respective dielectric layer, and one of the waveguides is formed with a pair of parallel line portions and an optimal bend portion connecting the pair of parallel line portions, the optimal bend portion has a semi-minor axis and a semi-major axis, and the optimal bend portion is of a semi-elliptical arc shape.
Dependencies are inferred from the claim text.