Radiation imaging device

A radiation imaging device comprising:

• a sensor panel provided with a detection region for detecting radiation;
• a support member having a support surface that supports the sensor panel, and a back surface opposite to the support surface;
• a control board disposed at a position facing the back surface of the support member and configured to process a signal read out from the sensor panel;
• a flexible printed circuit disposed to connect the sensor panel and the control board through a side of the support member when viewed from a first direction orthogonal to the support surface;
• an IC chip mounted on the flexible printed circuit and configured to perform processing for reading out the signal from the sensor panel;
• and
• a heat absorbing member provided between the support member and the IC chip on a side opposite to a side where the sensor panel is located with respect to the support member, and configured to absorb heat from the IC chip,
• wherein the heat absorbing member includes:
• a heat absorbing portion disposed in a region overlapping the flexible printed circuit when viewed from the first direction, and having a contact surface that contacts a surface of the IC chip opposite to a mounting surface of the IC chip on the flexible printed circuit;
• and
• a heat radiating portion connected to the heat absorbing portion and extending outward beyond an outer edge of the flexible printed circuit in a third direction intersecting a second direction, which is an extending direction of the flexible printed circuit, when viewed from the first direction, and
• wherein a thickness of the heat radiating portion in the first direction is greater than a thickness of the heat absorbing portion in the first direction.