Semiconductor inspection apparatus and inspection method

Abstract

According to one embodiment, a semiconductor inspection apparatus includes processing circuitry. The processing circuitry acquires an image of a wafer by photographing the wafer with a photographing device. The processing circuitry detects, based on the image, a first coordinate point of a threading dislocation that has appeared on a back surface of the wafer and a second coordinate point of the threading dislocation that has appeared on a top surface of the wafer. The processing circuitry analyzes, based on the first coordinate point and the second coordinate point and a thickness of the wafer, an inclination of a dislocation line of the threading dislocation relative to a thickness direction of the wafer. The processing circuitry classifies the threading dislocation based on a result of the analyzing.

Dependencies are inferred from the claim text.