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US 2026/0287519 A1Published application
Apparatus and method for handling wafer storage box
AssigneesTaiwan Semiconductor Manufacturing Company, Ltd., Tsmc China Company Limited
InventorsXiao JIN, Qin SUN
Life of this patent
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Abstract
A method includes opening a wafer storage box by using a gripping mechanism; determining whether a sealing strip is detached from a ledge of a first side of the wafer storage box; in response the determination determines that the sealing strip is detached from the ledge of the first side of the wafer storage box, performing a first maintenance process on the sealing strip.
Claims20
A method, comprising:
- opening a wafer storage box by using a gripping mechanism;
- determining whether a sealing strip is detached from a ledge of a first side of the wafer storage box;
- and
- in response the determination determines that the sealing strip is detached from the ledge of the first side of the wafer storage box, performing a first maintenance process on the sealing strip.
1 more element
A method, comprising:
- opening a wafer storage box to expose a sealing strip disposed over a ledge of a case of the wafer storage box;
- directing a light beam over the sealing strip;
- determining that the sealing strip is detached from the ledge when an intensity of the light beam received by a light sensor is less than a predetermined threshold value;
- and
- in response to determining that the sealing strip is detached from the ledge, adjusting a position of the sealing strip.
2 more elements
A method, comprising:
- opening a wafer storage box to expose a sealing strip disposed over ledges of a case of the wafer storage box;
- directing a light beam over a first portion of the sealing strip disposed over a ledge of a first side of the case;
- determining whether the first portion of the sealing strip is detached from the ledge of the first side based on whether the light beam is blocked;
- in response to determining that the first portion is detached from the ledge of the first side, performing a maintenance process on the first portion;
- rotating the wafer storage box to position a second side of the case below the light beam;
- and
- repeating the directing, determining, and performing for a second portion of the sealing strip disposed over a ledge of the second side.
4 more elements
Dependencies are inferred from the claim text.