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AssigneeThe Regents of the University of California
InventorsJiahui Cao, Jaeho Lee
Estimating the term…
A holey silicon-based thermopile for temperature measurement across an entire electromagnetic spectrum. The thermopile includes a substrate and a cavity formed by the substrate. The thermopile further includes a thermally isolated absorber disposed over the cavity, configured to accept an input radiation reading and output a heat signal and an array of thermocouples configured to connect the thermally isolated absorber to the substrate. The array of thermocouples includes a plurality of silicon structures, each silicon structure having a hole pattern made up of a plurality of holes disposed through the silicon structure. The thermally isolated absorber is suspended, over the cavity by the array of thermocouples. The thermopile further includes a temperature difference transducer operatively coupled to the thermally isolated absorber, configured to convert the heat signal into an electrical voltage signal.
A holey silicon-based thermopile (100) for temperature measurement across an entire electromagnetic spectrum, the thermopile (100) comprising:
A holey silicon-based thermopile (100) for temperature measurement across an entire electromagnetic spectrum, the thermopile (100) comprising:
A holey silicon-based thermopile (100) for temperature measurement across an entire electromagnetic spectrum, the thermopile (100) comprising:
Dependencies are inferred from the claim text.