Advanced thermal management systems with thermoelectric cold plate coolant system

A thermoelectric cold plate coolant system comprising:

• a cold plate body having a substantially planar top surface and a thickness of approximately 1 mm to 3 mm, said cold plate body constructed from a thermally conductive material and containing an internal network of coolant circulation channels;
• a plurality of thermoelectric cooling chips affixed to said top surface of said cold plate body, each said thermoelectric cooling chip comprising a plurality of semiconductor pellet pairs arranged between electrically conductive traces, wherein electrical current applied to said conductive traces induces thermoelectric cooling at a top surface of each said chip and heat generation at a bottom surface of each said chip, wherein said thermoelectric cooling chips are permanently bonded to said cold plate body through soldering or thermally conductive adhesive bonding to eliminate thermal interface resistance;
• a coolant inlet port and a coolant outlet port in fluid communication with said internal network of coolant circulation channels;
• a radiator assembly in fluid communication with said coolant outlet port, said radiator assembly comprising a finned heat exchanger and a forced-air cooling device, wherein said radiator assembly is configured to dissipate thermal energy from heated liquid coolant to ambient air through forced convection;
• a coolant circulation pump configured to maintain continuous single-phase liquid circulation through a closed loop comprising said cold plate body and said radiator assembly, wherein said liquid coolant remains in liquid phase throughout said closed loop during normal operation;
• and
• an electrical power supply configured to provide electrical power to said thermoelectric cooling chips, said coolant circulation pump, and said forced-air cooling device.