Heat pump
AssigneeLG Electronics Inc.
InventorsKiyoon PARK, ILHAN YUN, Jonghae LEE, Taeho KONG, Gwansoo LEE, Jungyoon KIM, Dongmin SEO, Changgeun HAN
Life of this patent
Estimating the term…
Loading patent…
AssigneeLG Electronics Inc.
InventorsKiyoon PARK, ILHAN YUN, Jonghae LEE, Taeho KONG, Gwansoo LEE, Jungyoon KIM, Dongmin SEO, Changgeun HAN
Estimating the term…
A heat pump includes a water inlet pipe assembly configured to receive water from an outside, the water inlet pipe assembly including a water inlet connecting pipe. The water inlet connecting pipe is made of a plastic material and includes at least one straight pipe portion, and at least one curved pipe portion having a bent shape. Additionally, the heat pump also includes a pump connected to the water inlet pipe assembly, a heat exchanger configured to exchange heat between the water discharged through a water outlet end of the pump and a refrigerant, and a water outlet pipe assembly configured to allow the heat-exchanged water to flow therethrough to the outside.
A heat pump comprising:
A heat pump comprising:
Dependencies are inferred from the claim text.