Thermal chamber type cooling plate structure with improved cooling performance
AssigneeSHENB Co., Ltd.
InventorSunyoung KANG
Life of this patent
Estimating the term…
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AssigneeSHENB Co., Ltd.
InventorSunyoung KANG
Estimating the term…
An embodiment relates to a thermal chamber type cooling plate structure with improved cooling performance, the thermal chamber type cooling plate structure including a chamber type cooling plate configured to come into direct contact with skin and absorb heat, a heat transfer cooling plate tightly attached and connected to the chamber type cooling plate and configured to absorb heat, which is generated from a needle cartridge accommodated in the heat transfer cooling plate, and heat, which is generated from a user's skin, and transfer the heat to a Peltier thermoelectric element, the Peltier thermoelectric element coupled to the heat transfer cooling plate and configured to absorb heat and transfer the heat to an opposite side, and a water block configured to circulate a coolant to discharge heat, which is discharged from the Peltier thermoelectric element, to the outside.
A thermal chamber type cooling plate structure with improved cooling performance, the thermal chamber type cooling plate structure comprising:
A thermal chamber type cooling plate structure with improved cooling performance, the thermal chamber type cooling plate structure comprising:
Dependencies are inferred from the claim text.