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US 2026/0287187 A1Published application
Heat pump
AssigneeLG Electronics Inc.
InventorsKiyoon PARK, ILHAN YUN, Jonghae LEE, Taeho KONG, Gwansoo LEE, Jungyoon KIM, Dongmin SEO, Changgeun HAN
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Abstract
A heat pump includes a water inlet pipe assembly including a water inlet pipe, the water inlet pipe assembly being configured to receive water from an outside, the water inlet pipe comprising a plastic material, a pump configured to circulate the water introduced from the water inlet pipe assembly, a heat exchanger configured to exchange heat between the water circulated from the pump and a refrigerant, and a water outlet pipe assembly configured to allow the heat-exchanged water to flow therethrough to the outside.
Claims20
A heat pump comprising:
- a water inlet pipe assembly comprising a water inlet pipe, the water inlet pipe assembly being configured to receive water from an outside, the water inlet pipe comprising a plastic material;
- a pump configured to circulate the water introduced from the water inlet pipe assembly;
- a heat exchanger configured to exchange heat between the water circulated from the pump and a refrigerant;
- and
- a water outlet pipe assembly configured to allow the heat-exchanged water to flow therethrough to the outside.
2 more elements
Dependencies are inferred from the claim text.