Adhesive film for circuit connection, circuit connection structure, and method for producing same
AssigneeResonac Corporation
InventorsTakashi NAKAZAWA, Masato FUKUI, Kazuya NARITOMI, Takayuki ICHIMURA, Tomoki TAKAYAMA
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Abstract
An adhesive film for circuit connection includes a thermosetting resin component and electroconductive particles, and the thermosetting resin component contains a fluorene skeleton-containing epoxy resin represented by the following general formula (1) and an epoxy resin thermosetting agent. in the formula (1), RE is a skeleton residue derived from an epoxy resin, RP is a skeleton residue derived from a phenol compound having a fluorene skeleton, and n represents the number of repetitions.
Claims9
An adhesive film for circuit connection, comprising a thermosetting resin component and electroconductive particles, wherein
- the thermosetting resin component contains a fluorene skeleton-containing epoxy resin represented by the following general formula (1) and an epoxy resin thermosetting agent:
- in the formula (1), RE is a skeleton residue derived from an epoxy resin, RP is a skeleton residue derived from a phenol compound having a fluorene skeleton, and n represents the number of repetitions.
An adhesive film for circuit connection, comprising a first adhesive layer containing electroconductive particles, a cured product of a photocurable resin component, and a first thermosetting resin component, and a second adhesive layer provided on the first adhesive layer and containing a second thermosetting resin component, wherein
- the second thermosetting resin component contains a fluorene skeleton-containing epoxy resin represented by the following general formula (1) and an epoxy resin thermosetting agent:
- in the formula (1), RE is a skeleton residue derived from an epoxy resin, RP is a skeleton residue derived from a phenol compound having a fluorene skeleton, and n represents the number of repetitions.
Dependencies are inferred from the claim text.