Silicon-containing thermally conductive pastes
AssigneeWacker Chemie AG
InventorSebastian Knoer
Life of this patent
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Abstract
A non-crosslinkable, heat-conducting silicone composition (Y) includes 5-50% by volume of at least one non-crosslinkable silicone composition (S) and 50-95% by volume of at least one thermally conductive filler (Z) having a thermal conductivity of at least 5 W/mK. The non-crosslinkable, thermally conductive silicone composition (Y) has a thermal conductivity of at least 0.6 W/mK and at least 20% by volume of metallic silicon particles that are present as thermally conductive fillers (Z) have median diameter x50 in the range of 30-200 μm, are predominately rounded, and characterized in that the width/length ratio (aspect ratio w/l) is at least 0.76, and have a distribution range SPAN ((x90−x10)/x50) of at least 0.28.
Claims13
1-12. (canceled)
Non-crosslinkable, heat-conducting silicone composition (Y) comprising
- 5-50% by volume of at least one non-crosslinkable silicone composition (S) and
- 50-95% by volume of at least one thermally conductive filler (Z) having a thermal conductivity of at least 5 W/mK, with the proviso that
- the non-crosslinkable, thermally conductive silicone composition (Y) has a thermal conductivity of at least 0.6 W/mK, and that
- at least 20% by volume of metallic silicon particles that are present as thermally conductive fillers (Z) fulfil the following features:
- a) their median diameter x50 is in the range of 30-200 μm;
- b) they are predominately rounded, and characterized in that the width/length ratio (aspect ratio w/l) is at least 0.76;
- c) their distribution range SPAN ((x90−x10)/x50) is at least 0.28.
Dependencies are inferred from the claim text.