Back to results
US 2026/0286059 A1Published application
Prepreg, laminate, printed wiring board, and semiconductor package
AssigneeResonac Corporation
InventorsKeitaro IGUCHI, Tsutomu SATO, Shun HIYAMA, Mami SHIMADA
Life of this patent
Estimating the term…
Abstract
Disclosed are: a prepreg which contains a resin composition containing a siloxane-modified maleimide resin and a fiber substrate containing glass fibers having an Al2O3 content of 20% by mass or more; and a laminated plate, a printed wiring board, and a semiconductor package which use the prepreg.
Claims8
A prepreg comprising:
- a resin composition containing a siloxane-modified maleimide resin;
- and a fiber substrate containing glass fibers having an Al2O3 content of 20% by mass or more.
Dependencies are inferred from the claim text.