Photosensitive resin composition, cured product, and semiconductor element
AssigneeResonac Corporation
InventorsKitaru SATO, Keisuke NISHIDO
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Abstract
A photosensitive resin composition contains a maleimide resin, a (meth)acrylic monomer, a photopolymerization initiator, and an organic solvent, in which the maleimide resin is a reaction product of tetracarboxylic dianhydride (a1), amine (a2), and maleic anhydride (a3), the amine (a2) includes a dimer diamine, the (meth)acrylic monomer includes a bifunctional (meth)acrylic monomer, and the organic solvent includes a high-boiling-point solvent having a boiling point of 150 to 200° C.
Claims6
A photosensitive resin composition comprising a maleimide resin, a (meth)acrylic monomer, a photopolymerization initiator, and an organic solvent,
- wherein the maleimide resin is a reaction product of tetracarboxylic dianhydride (a1), amine (a2), and maleic anhydride (a3),
- the amine (a2) includes a dimer diamine,
- the (meth)acrylic monomer includes a bifunctional (meth)acrylic monomer, and the organic solvent includes a high-boiling-point solvent having a boiling point of 150 to 200° C.
Dependencies are inferred from the claim text.