Forming vacuum cells comprising a first substrate and a second substrate

A method for forming one or more vacuum cells comprising at least a portion of a first substrate and at least a portion of a second substrate, the method comprising:

• forming a layer of a bonding material on a first surface of the first substrate;
• forming a layer of the bonding material on a second surface of the first substrate;
• creating one or more cutouts extending from a respective portion of the first surface to a respective portion of the second surface of the first substrate, wherein each cutout of the one or more cutouts extends through the layer of the bonding material deposited on the first surface of the first substrate and through the layer of the bonding material deposited on the second surface of the first substrate;
• aligning a first surface of the second substrate to the first surface of the first substrate;
• and
• bonding the first substrate to the second substrate, the bonding comprising
• applying, with a bonding structure, a pressure to a portion of the layer of the bonding material between the first surface of the first substrate and the first surface of the second substrate after the aligning, wherein the bonding structure is configured to prevent an electrical current from flowing from the layer of the bonding material on the first surface of the first substrate to the layer of the bonding material on the second surface of the first substrate, and
• applying, while the pressure is applied, a voltage between the layer of the bonding material on the first surface of the first substrate and the second substrate.