Three-dimensional robotic calibration device
AssigneeNanoverse Technologies Ltd
InventorsJeff Albelo, William Robertson
Life of this patent
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AssigneeNanoverse Technologies Ltd
InventorsJeff Albelo, William Robertson
Estimating the term…
A semiconductor fabrication facility has numerous Si wafer processing modules. Robotic arms transfer the Si wafers and processing equipment about, bringing the Si wafers in through an equipment front end module (EFEM). Precision in positioning the Si wafers is the key to a higher production yield and to minimizing Si wafer culls. The robots can only move about the module based on the module computer's directional instructions. These are based on an initial factory robotic arm calibration which sets the module dimensions based on the SEMI standards (of the EFEM's interior dimensions) and with respect to a known reference location in the EFEM. Physical collisions occur within modules, and dimensions may change, especially in the Si wafer's locations within a FOUP. This system uses dual lidar sensors mounted on a robotic arm in concert with 3-D reference targets on the EFEM and a FOUP alignment tool to calibrate the robot's three-dimensional awareness of both its spatial relation to the fixed elements of the EFEM as well as to Si wafers in a FOUP.
A method to calibrate an existing semiconductor production facility Equipment Front End Module (EFEM) control computer's digital three-dimensional positional mapping of the EFEM interior walls, comprising the steps of:
Dependencies are inferred from the claim text.