Polishing head and polishing apparatus
AssigneeEbara Corporation
InventorsKeisuke UCHIYAMA, Satoru YAMAMOTO
Life of this patent
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Abstract
The present invention relates to a polishing head for pressing a polishing tape against a substrate, such as a wafer. Further, the present invention relates to a polishing apparatus for polishing the substrate with such a polishing head. The polishing head (10) for polishing the substrate (W) includes: a pressing member (12) configured to press the polishing tape (2) against the substrate (W); and an actuator (15) coupled to the pressing member (12) and configured to apply a pressing force to the pressing member (12). The pressing member (12) has multiple protrusions (50), and the multiple protrusions (50) are arranged along a longitudinal direction of the pressing member (12) and are arranged along an advancing direction (Z) of the polishing tape (2).
Claims5
A polishing head for polishing a substrate, comprising:
- a pressing member configured to press a polishing tape against a substrate;
- and
- an actuator coupled to the pressing member and configured to apply a pressing force to the pressing member,
- wherein the pressing member has multiple protrusions, and
- the multiple protrusions are arranged along a longitudinal direction of the pressing member and are arranged along an advancing direction of the polishing tape.
Dependencies are inferred from the claim text.