Laser peening method and laser peening device
AssigneeHamamatsu Photonics K.K.
InventorsTakeshi WATARI, Yuta KINE, Takashi KURITA, Koichi SAKAI, Masateru KURATA
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AssigneeHamamatsu Photonics K.K.
InventorsTakeshi WATARI, Yuta KINE, Takashi KURITA, Koichi SAKAI, Masateru KURATA
Estimating the term…
This laser peening method includes a placing step of placing an extension jig relative a workpiece W to form an extended surface formed by the extension jig in a region outside a surface Wa of the workpiece in a front view of a machining region K, a forming step of forming a water film P formed by a laminar flow over an irradiation position M2 of a laser beam L and at least a part of the extended surface by discharged water Pw directed to a target position M1, and a machining step of scanning the irradiation position M2 of the laser beam L and the target position M1 of the discharged water Pw with respect to the surface Wa of the workpiece W and irradiating the machining region K with the laser beam L through the water film P.
A laser peening method for performing peening by irradiating a machining region set on a surface of a workpiece with a laser beam, comprising:
A laser peening device configured to perform peening by irradiating a machining region set on a surface of a workpiece with a laser beam, comprising:
Dependencies are inferred from the claim text.