Laser processing apparatus
AssigneeMusashi WIRED Co., Ltd.
InventorsNaohiko SOMA, Ryo SATO, Hiroki SASAZAKI
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AssigneeMusashi WIRED Co., Ltd.
InventorsNaohiko SOMA, Ryo SATO, Hiroki SASAZAKI
Estimating the term…
To provide a laser processing apparatus which reliably prevents clogging of through holes in a thin film and dirt on the thin film likely to occur due to adhesion of processing dust on the thin film during laser processing and creates numerous fine through holes in the thin film with a high precision and at a high speed. A laser processing apparatus 100 comprising: a laser processing apparatus main body 110 configured to radiate pulsed laser light LP from inside of a cylindrical body 111 through a slit-shaped gap region of the cylindrical body 111 onto a long, thin film TF, while the thin film TF is wound obliquely around the cylindrical body 111 provided with the gap region 111b having a shape of a circular arc along a circumferential surface 111a and is transferred in a longitudinal direction of the thin film TF, and continuously create numerous through holes TH in this thin film TF; and a dust collector 120 provided adjacent to the cylindrical body 111 of this laser processing apparatus main body 110 and configured to suck in and remove processing dust FM generated from laser processing.
A laser processing apparatus comprising:
Dependencies are inferred from the claim text.