Method for bonding
AssigneeKabushiki Kaisha Toshiba
InventorTaizo Tomioka
Life of this patent
Estimating the term…
Abstract
According to one embodiment, a bonding method for bonding a first member containing a metal and a second member containing a metal, the method includes a first step of forming a process-affected layer with residual tensile stress in one or both of a surface to be bonded of the first member and a surface to be bonded of the second member, a second step of causing the surface to be bonded of the first member and the surface to be bonded of the second member to face each other, and a third step of bonding the surface to be bonded of the first member and the surface to be bonded of the second member by pressing and heating.
Claims7
A method for bonding a first member containing a metal and a second member containing a metal, the method comprising:
- a first step of forming a process-affected layer with residual tensile stress remains on one or both of a surface to be bonded of the first member and a surface to be bonded of the second member,
- a second step of causing a surface to be bonded of the first member and a surface to be bonded of the second member to face each other, and
- a third step of bonding the surface to be bonded of the first member and the surface to be bonded of the second member by pressing and heating.
Dependencies are inferred from the claim text.