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US 2026/0284773 A1Published application
Ultrasonic welding systems for welding a conductive pin to a workpiece, and related power modules
AssigneeKulicke and Soffa Industries, Inc.
InventorsTodd J. Walker, Omid Niayesh, Henri Seppaenen
Life of this patent
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Abstract
A conductive pin for ultrasonic welding is provided. The conductive pin includes a body portion. The conductive pin also includes a pin head at one end of the body portion. The pin head defines a bonding surface configured to be ultrasonically welded to a workpiece. The bonding surface includes at least one of (i) a nonplanar surface and (ii) an aperture defined in a central region of the bonding surface.
Claims20
A power module comprising:
- a semiconductor element;
- a carrier for supporting the semiconductor element;
- and
- at least one conductive pin ultrasonically welded to the carrier, the conductive pin including a body portion and a pin head at one end of the body portion, the pin head defining a bonding surface that is welded to the carrier,
- wherein the bonding surface of the conductive pin, prior to being ultrasonically welded to the carrier, included at least one of (i) a nonplanar surface and (ii) an aperture defined in a central region of the bonding surface.
2 more elements
An ultrasonic welding system configured for welding a conductive pin to a workpiece, the ultrasonic welding system comprising:
- a sonotrode configured to ultrasonically weld the conductive pin to the workpiece during a welding process;
- and
- a control system configured to control the welding process, the welding process including bonding a bonding surface of the conductive pin to the workpiece, the bonding surface including at least one of (i) a nonplanar surface and (ii) an aperture defined in a central region of the bonding surface.
Dependencies are inferred from the claim text.