Wire electrical discharge machining apparatus, wire electrical discharge machining method, and wafer manufacturing method
AssigneeMitsubishi Electric Corporation
InventorHidetaka MIYAKE
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AssigneeMitsubishi Electric Corporation
InventorHidetaka MIYAKE
Estimating the term…
A wire electrical discharge machining apparatus includes: wire parallel guide rollers disposed so as to sandwich the workpiece, in each of which wire guide grooves are formed on an outer peripheral side surface at equal intervals, the wire guide grooves causing cutting wire parts to fit therein and restricting movement of the cutting wire parts; parallel wire extension position measurement units measuring a distance between a reference surface and a wire electrode constituting the cutting wire parts; a wire guide groove detachment detection unit that detects a change in the distance; and a wire state determination unit that determines whether a state where at least one of the cutting wire parts is detached from the wire guide groove or a state where all the cutting wire parts are in contact with the wire guide grooves, based on the change.
A wire electrical discharge machining apparatus that generates electrical discharge between a plurality of cutting wire parts that are running and a workpiece to perform electrical discharge machining on the workpiece with energy generated by the electrical discharge, and simultaneously cuts a plurality of wafers from the workpiece, the wire electrical discharge machining apparatus comprising:
A wire electrical discharge machining method that generates electrical discharge between a plurality of cutting wire parts that are running and a workpiece to perform electrical discharge machining on the workpiece with energy generated by the electrical discharge, and simultaneously cuts a plurality of wafers from the workpiece, the wire electrical discharge machining method comprising:
Dependencies are inferred from the claim text.