Substrate processing apparatus

A substrate processing apparatus configured to apply a coating liquid to a substrate, comprising:

• a chuck configured to hold the substrate in a horizontal posture;
• a rotation mechanism configured to rotate the chuck about a vertical axis passing through a center of the substrate held by the chuck;
• a coating liquid nozzle configured to discharge the coating liquid to an upper surface of the substrate held by the chuck;
• a solvent scattering mechanism configured to scatter a solvent outward in a rotation radius direction of the chuck, in cooperation with the rotation mechanism;
• and
• a cup configured to recover the scattered solvent, wherein
• the cup includes
• an upper cup provided so as to surround a side of the substrate held by the chuck,
• a lower cup that is a ring-shaped container provided below the upper cup, a drainage area and an exhaust area being provided separately in the container, and
• a middle cup disposed in a ring shape between the upper cup and the lower cup so as to cover an upper side of the exhaust area of the lower cup, and
• the middle cup is inclined downward from an outer peripheral end portion of the middle cup toward an inner peripheral end portion of the middle cup, is capable of receiving the coating liquid and the solvent that have flowed down along an inner surface of the upper cup on a side of the outer peripheral end portion, and is configured to cause the received coating liquid and the solvent to flow downward to a side of the inner peripheral end portion to be guided to the drainage area of the lower cup.