Mobile palmar cooling technology
OwnerBria Romero, Josh Goforth +3inventors
InventorsBria Romero, Josh Goforth, Dylan Ueyama-Burke, Tiffany Vuong, Aman Eujayl
Life of this patent
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Abstract
A portable cooling unit includes a conductive plate having a first side and a second side. The portable cooling unit includes a heat sink having an upper side, a lower side, and a body thermally connecting the upper side and the lower side. The portable cooling unit includes a fan having an air outlet side and an air inlet side. The portable cooling unit optionally includes one or more heat pipes thermally connecting the conductive plate to the heat sink. The portable cooling unit optionally includes a Peltier module for dissipating heat from the conductive plate and/or the heat pipes.
Claims55
A portable cooling unit, comprising:
- a conductive plate having a first side and a second side;
- a heat sink having an upper side, a lower side, and a body thermally connecting the upper side and the lower side, the upper side of the heat sink positioned facing the second side of the conductive plate;
- a fan having an air outlet side and an air inlet side, the fan connected to the heat sink such that the air outlet side faces the lower side of the heat sink;
- a power source connected to the fan via at least one connecting cable;
- and
- one or more heat pipes thermally connecting the conductive plate to the heat sink.
The portable cooling unit according to any one of the preceding claims, wherein the power source is a battery configured to be secured to a wrist of the user via at least one wrist strap.
The portable cooling unit according to any one of the preceding claims, further comprising at least one temperature probe disposed on the first side of the conductive plate, the at least one temperature probe configured to measure a surface temperature of the first side of the conductive plate.
The portable cooling unit according to any one of the preceding claims, further comprising a liquid cooling system comprising:
- an internal fluid chamber thermally connected to the second side of the conductive plate, the internal fluid chamber comprising conductive tubing;
- and
- a pump fluidically connected to the internal fluid chamber via at least one fluid port, the pump configured to circulate a coolant through the conductive tubing of the internal fluid chamber,
- wherein the pump is electrically connected to the power source via at least one connecting cable, and
- wherein the coolant is configured to remove heat from the conductive plate.
The portable cooling unit according to any one of the preceding claims, further comprising a cooling element thermally connected to the heat sink, the cooling element configured to remove heat from the heat sink.
The portable cooling unit according to any one of the preceding claims, wherein the heat sink comprises a plurality of fins configured to increase a surface area of the heat sink for heat dissipation.
The portable cooling unit according to any one of the preceding claims, wherein heat dissipation from the heat sink occurs via at least one of radiation, conduction, or convection.
The portable cooling unit according to any one of the preceding claims, wherein the conductive plate further comprises an insulation layer disposed on the first side of the conductive plate, the insulative layer configured to prevent loss of heat from the first side of the conductive plate.
The portable cooling unit according to any one of the preceding claims, wherein the one or more heat pipes are made from a thermally conductive material.
The portable cooling unit according to any one of the preceding claims, wherein the one or more heat pipes comprise between two and thirty heat pipes.
The portable cooling unit according to any one of the preceding claims, wherein the one or more heat pipes comprise six heat pipes.
The portable cooling unit according to any one of the preceding claims, wherein each of the one or more heat pipes comprises:
- a hot interface thermally connected to the conductive plate;
- a cold interface thermally connected to the heat sink;
- a conductive tunnel connecting the hot interface and the cold interface;
- and
- a volatile liquid disposed at the hot interface, the volatile liquid configured to remove the heat from the conductive plate and phase-change to a vapor.
A portable cooling unit, comprising:
- a conductive plate having a first side and a second side, the first side of the conductive plate configured to interface with a palm of a user and configured to be secured with the palm of the user via at least one connecting strap;
- a heat sink having an upper side, a lower side, and a body thermally connecting the upper side and the lower side, the upper side of the heat sink positioned facing the second side of the conductive plate, the heat sink comprising a plurality of fins disposed on the body, the plurality of fins being configured to increase a surface area of the heat sink for heat dissipation;
- a fan having an air outlet side and an air inlet side, the fan connected to the heat sink such that the air outlet side faces the lower side of the heat sink;
- a power source connected to the fan via at least one connecting cable and configured to be secured to a wrist of the user via at least one wrist strap;
- and
- one or more heat pipes thermally connecting the conductive plate to the heat sink.
A portable cooling unit, comprising:
- a conductive plate having a first side and a second side;
- a heat sink having an upper side, a lower side, and a body thermally connecting the upper side and the lower side, the upper side of the heat sink positioned facing the second side of the conductive plate, the heat sink comprising a plurality of fins disposed on the body, the plurality of fins being configured to increase a surface area of the heat sink for heat dissipation;
- a power source;
- and
- a Peltier module electrically connected to the power source via at least one connecting cable, the Peltier Module comprising:
- a heat absorbing end thermally connected to the second side of the conductive plate and configured to absorb heat from the conductive plate;
- a heat releasing end thermally connected to the upper side of the heat sink and configured release the absorbed heat from the conductive plate into the heat sink;
- and
- a plurality of semiconductor elements electrically connected to the power source, the plurality of semiconductor elements thermally connecting the heat absorbing end and the heat releasing end.
A portable cooling unit, comprising:
- a conductive plate having a first side and a second side;
- a heat sink having an upper side, a lower side, and a body thermally connecting the upper side and the lower side, the upper side of the heat sink positioned to facing the second side of the conductive plate, the heat sink comprising a plurality of fins disposed on the body, the plurality of fins being configured to increase a surface area of the heat sink for heat dissipation;
- a fan having an air outlet side and an air inlet side, the fan connected to the heat sink such that the air outlet side is positioned faces the lower side of the heat sink,
- a power source connected to the fan via at least one connecting cable;
- one or more heat pipes thermally connecting the conductive plate to the heat sink;
- and
- a Peltier module electrically connected to the power source via at least one connecting cable, the Peltier Module comprising:
- a heat absorbing end thermally connected to the second side of the conductive plate and configured to absorb heat from the conductive plate;
- a heat releasing end thermally connected to the upper side of the heat sink and configured release the absorbed heat from the conductive plate into the heat sink;
- and
- a plurality of semiconductor elements electrically connected to the power source, the plurality of semiconductor elements thermally connecting the heat absorbing end and the heat releasing end.
A portable cooling unit, comprising:
- a conductive plate having a first side and a second side;
- a heat sink having an upper side, a lower side, and a body thermally connecting the upper side and the lower side, the upper side of the heat sink positioned facing the second side of the conductive plate, the heat sink comprising a plurality of fins disposed on the body, the plurality of fins being configured to increase a surface area of the heat sink for heat dissipation;
- a fan having an air outlet side and an air inlet side, wherein the fan is connected to the heat sink such that the air outlet side is positioned to face the lower side of the heat sink,
- a power source connected to the fan via at least one connecting cable;
- one or more heat pipes;
- and
- a Peltier module electrically connected to the power source via at least one connecting cable, the Peltier Module comprising:
- a heat absorbing end thermally connected to the one or more heat pipes and configured to absorb heat from the one or more heat pipes;
- a heat releasing end thermally connected to the upper side of the heat sink and configured release the absorbed heat from the one or more heat pipes into the heat sink;
- and
- a plurality of semiconductor elements electrically connected to the power source, the plurality of semiconductor elements thermally connecting the heat absorbing end and the heat releasing end.
A portable cooling unit, comprising:
- a conductive plate having a first side and a second side;
- a heat sink having an upper side, a lower side, and a body thermally connecting the upper side and the lower side, the upper side of the heat sink positioned facing the second side of the conductive plate, the heat sink comprising a plurality of fins disposed on the body, the plurality of fins being configured to increase a surface area of the heat sink for heat dissipation;
- a fan connected to the power source via at least one connecting cable, the fan having an air outlet side and an air inlet side, the fan connected to the heat sink such that the air outlet side is positioned facing the lower side of the heat sink;
- a power source connected to the fan via at least one connecting;
- one or more heat pipes thermally connecting the conductive plate to the heat sink;
- a liquid cooling system comprising:
- an internal fluid chamber thermally connected to the second side of the conductive plate, the internal fluid chamber comprising conductive tubing;
- and
- a pump electrically connected to the power source via at least one connecting cable and fluidically connected to the internal fluid chamber via at least one fluid port, the pump configured to circulate a coolant through the conductive tubing of the internal fluid chamber, the coolant configured to remove heat from the conductive plate via convection;
- and
- a Peltier module electrically connected to the power source via at least one connecting cable, the Peltier Module comprising:
- a heat absorbing end thermally connected to the one or more heat pipes and configured to absorb heat from the one or more heat pipes;
- a heat releasing end thermally connected to the upper side of the heat sink and configured release the absorbed heat from the one or more heat pipes into the heat sink;
- and
- a plurality of semiconductor elements electrically connected to the power source, the plurality of semiconductor elements thermally connecting the heat absorbing end and the heat releasing end.
Dependencies are inferred from the claim text.