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US 2026/0283040 A1Published application
Flexible led display having an optic optically coupled with an led chip
AssigneeAutosystems, a division of Magna Exteriors Inc.
InventorEdward Bailey
Life of this patent
Estimating the term…
Abstract
An LED display includes an LED chip configured to emit light about a focal axis. A circuit board is configured to selectively electrify the LED chip. The circuit board is elastically deformable. An optic is optically coupled with the LED chip and defines an optical axis. The optic is elastically deformable. The optical axis and the focal axis maintain a generally aligned position when the circuit board is positioned in a non-planar orientation.
Claims21
1-20. (canceled)
An LED display comprising:
- an LED chip configured to emit light about a focal axis;
- a circuit board configured to selectively electrify the LED chip, wherein the circuit board is elastically deformable;
- and
- a collimating optic molded onto the LED chip as a unitary encapsulating structure that is elastically deformable, the optic comprising a mold-in-clear (MIC) material and defining an optical axis, wherein the optical axis and the focal axis maintain alignment when the circuit board is positioned in a non-planar orientation.
1 more element
A method for manufacturing a LED display, the method comprising:
- producing a flexible circuit board substrate;
- mounting an LED chip configured to emit light about a focal axis on the flexible circuit board substrate;
- and
- molding a collimating optic formed from an optical-grade flexible material onto the LED chip and adjacent portions of the flexible circuit board substrate to form a unitary encapsulating structure that is elastically deformable, the optic defining an optical axis,
- wherein the optical axis and the focal axis maintain a generally aligned position when the circuit board is positioned in a non-planar orientation.
2 more elements
A vehicle LED display comprising:
- an LED chip configured to emit light about a focal axis;
- a circuit board configured to selectively electrify the LED chip, wherein the circuit board is elastically deformable and comprises a plurality of conductive layers separated by respective substrate layers, wherein the conductive layers and the substrate layers, in combination, define a first thermal via and a second thermal via extending through the conductive layers and the substrate layers, wherein the first thermal via and the second thermal via each include an interconnect and a filler material disposed adjacent to the interconnect, the first thermal via and the second thermal via configured to dissipate heat generated by the LED chip;
- and
- an optic optically coupled with the LED chip and defining an optical axis, wherein the optic is elastically deformable, and wherein the optical axis and the focal axis maintain a generally aligned position when the circuit board is positioned in a non-planar orientation.
1 more element
Dependencies are inferred from the claim text.