Method to correct wafer placement for channel implant

A workpiece processing system, comprising:

• a chuck configured to support a workpiece on a support surface, wherein the chuck is configured to rotate about a twist axis, the twist axis being orthogonal to the support surface;
• a robot arm having an end effector configured to transport the workpiece to and from the support surface of the chuck, the chuck disposed in a first position;
• a camera configured to capture one or more images of the workpiece disposed on the support surface of the chuck in the first position;
• and
• a controller in electronic communication with the camera, the chuck, and the robot arm, wherein the controller is configured to:
• receive the one or more images of the workpiece from the camera;
• determine an orientation of the workpiece based on the one or more images of the workpiece;
• determine an error correction based on the orientation of the workpiece;
• send instructions to the robot arm to remove the workpiece from the support surface of the chuck;
• send instructions to the chuck to rotate about the twist axis or send instructions to the robot arm to move the workpiece according to the error correction;
• and
• send instructions to the robot arm to dispose the workpiece onto the support surface of the chuck to correct the orientation of the workpiece.