Bonding apparatus, bonding system, and bonding method

A bonding system configured to bond a first substrate and a second substrate, comprising:

• a processing station comprising a bonding apparatus configured to bond the first substrate and the second substrate;
• and
• a carry-in/out station configured to carry the first substrate, the second substrate, and a combined substrate in which the first substrate the second substrate are bonded to each other with respect to the processing station,
• wherein the bonding apparatus comprises:
• a first holder configured to hold the first substrate;
• a second holder disposed to face the first holder, and configured to hold the second substrate;
• a processing vessel accommodating therein the first holder and the second holder;
• and
• a horizontal position adjuster provided outside the processing vessel and connected to the first holder via a support configured to support the first holder, the horizontal position adjuster being configured to adjust a horizontal position of the first holder,
• wherein the support comprises:
• a moving plate provided outside the processing vessel and connected to the horizontal position adjuster;
• a transmission shaft penetrating the processing vessel and connecting the moving plate and the first holder;
• and
• a first bellows provided on outer peripheral portions of the transmission shaft and configured to cover the transmission shaft.

A bonding method of bonding a first substrate and a second substrate by using a bonding apparatus,

• wherein the bonding apparatus comprises:
• a first holder configured to hold the first substrate;
• a second holder disposed to face the first holder, and configured to hold the second substrate;
• a processing vessel accommodating therein the first holder and the second holder;
• and
• a horizontal position adjuster provided outside the processing vessel and connected to the first holder via a support configured to support the first holder, the horizontal position adjuster being configured to adjust a horizontal position of the first holder.
• wherein the support comprises:
• a moving plate provided outside the processing vessel and connected to the horizontal position adjuster;
• a transmission shaft penetrating the processing vessel and connecting the moving plate and the first holder;
• and
• a first bellows provided on outer peripheral portions of the transmission shaft and configured to cover the transmission shaft, and
• wherein the bonding method comprises:
• holding the first substrate by the first holder;
• holding the second substrate by the second holder;
• adjusting the horizontal position of the first holder by the horizontal position adjuster;
• and
• bonding the first substrate and the second substrate.