Pedestal stem cooling system

Abstract

Pedestal stem cooling systems for providing effective cooling to pedestal stems in situations in which the pedestals may be at temperatures exceeding 600° C. are provided. The system comprises: a pedestal having a first side configured to support a semiconductor wafer during semiconductor processing operations and a second side opposite the first side; a stem having a first end connected with the pedestal and a second end located farther from the second side than the first end of the stem; a support structure connected with the second end of the stem, the support structure having at least one first surface that is axially mated with a second surface located at or proximate to the second end of the stem; and a first cooling passage segment positioned such that at least one first surface is interposed between the first cooling passage segment and the stem.

Dependencies are inferred from the claim text.