Optoelectronic semiconductor device comprising a filling material and method for manufacturing the optoelectronic semiconductor device

An optoelectronic semiconductor device comprising:

• a semiconductor layer stack configured to generate electromagnetic radiation;
• a mirror comprising horizontal dielectric layers, arranged over a first main surface of the semiconductor layer stack, an opening being formed in the mirror, the opening extending from a first main surface of the mirror to a second surface of the mirror, the first main surface of the mirror being remote from the semiconductor layer stack;
• a conductive layer arranged over the first main surface of the mirror the conductive layer being arranged on sidewalls of the opening thereby defining a void, and being configured to electrically contact a portion of the semiconductor layer stack;
• a filling material filling the void, the filling material being different from the conductive layer;
• a solder layer over the filling material and over the conductive layer a material of the solder layer being different from the filling material;
• and
• a conductive carrier over the solder layer.