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US 2026/0282590 A1Published application
Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsJia Liu, Eitaro Miyake
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Abstract
According to one embodiment, a semiconductor device includes: a substrate; a first transistor and a second transistor provided in the substrate; a first wiring provided in the substrate and contacting each of a source electrode of the first transistor and a source electrode of the second transistor; and a photocoupler provided on an upper surface of the substrate and configured to control states of the first transistor and the second transistor.
Claims14
A semiconductor device comprising:
- a substrate;
- a first transistor and a second transistor provided in the substrate;
- a first wiring provided in the substrate and contacting each of a source electrode of the first transistor and a source electrode of the second transistor;
- and
- a photocoupler provided on an upper surface of the substrate and configured to control states of the first transistor and the second transistor.
2 more elements
Dependencies are inferred from the claim text.