Semiconductor device and method for fabricating the same
AssigneeUnited Microelectronics Corp.
InventorsGuang-Yu Lo, Chun-Tsen Lu, Chung-Fu Chang, Chih-Shan Wu, Yu-Hsiang Lin, Wei-Hao Chang
Life of this patent
Estimating the term…
Loading patent…
AssigneeUnited Microelectronics Corp.
InventorsGuang-Yu Lo, Chun-Tsen Lu, Chung-Fu Chang, Chih-Shan Wu, Yu-Hsiang Lin, Wei-Hao Chang
Estimating the term…
ABSTRACT OF DISCLOSURE A method for fabricating a semiconductor device includes the steps of forming a fin-shaped structure on a substrate, forming a first trench and a second trench in the fin-shaped structure, forming a first dielectric layer in the first trench and the second trench, removing part of the first dielectric layer, forming a second dielectric layer in the first trench and the second trench to form a first single diffusion break (SDB) structure and a second SDB structure, and then forming a gate structure on the fin-shaped structure, the first SDB structure, and the second SDB structure.
A method for fabricating a semiconductor device, comprising:
Dependencies are inferred from the claim text.