Thermal management systems and methods for power devices

A thermal management system for a power device comprising:

• a printed circuit board having a first surface;
• at least one electronic component of the printed circuit board, each of the at least one electronic component having an outward surface;
• and
• a cooling jacket having
• a main portion covering the outward surface of the at least one electronic component,
• an injection inlet formed in the main portion, the injection inlet configured to receive a coolant fluid into the cooling jacket and to direct a jet of the coolant fluid toward the outward surface of the at least one electronic component, and
• an overhang portion overhanging a side surface of the at least one electronic component, the overhang portion including an opening between the cooling jacket and the first surface of the printed circuit board that provides an exit out of the cooling jacket for the coolant fluid directed toward the outward surface.

A method of managing thermal energy, the method comprising:

• receiving a coolant fluid at an inlet of a coolant fluid pathway volume defined by an inner surface of a cooling jacket and a board surface profile, the board surface profile formed by a first surface of a printed circuit board and outward surfaces of a plurality of electronic components of the printed circuit board and the inner surface having a surface profile that mimics the board surface profile;
• cooling a plurality of electronic components via the coolant fluid traveling through the coolant fluid pathway volume;
• and
• outputting the coolant fluid from an outlet of the coolant fluid pathway volume.

A method of managing thermal energy, the method comprising:

• receiving a coolant fluid at an inlet formed in a main portion of cooling jacket, the main portion covering an outward surface of an electronic component on a first surface of a printed circuit board;
• directing, by a channel coupled to the inlet, a jet of the coolant fluid toward the outward surface of the electronic component;
• and
• expelling the coolant fluid out of the cooling jacket via an opening in an overhang portion of the cooling jacket, the opening being between the cooling jacket and the first surface of the printed circuit board.