Electronic device and cooling assembly
AssigneesInventec (Pudong) Technology Corporation, Inventec Corporation
InventorsGuoping WU, Lian-Fei ZHANG
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Abstract
An electronic device includes a cooling assembly and at least one hard disk drive. The cooling assembly includes a vapor chamber and a plurality of thermally conductive structures. The plurality of thermally conductive structures are arranged side by side on two opposite sides of the vapor chamber to form at least one cooling space. The plurality of thermally conductive structures are thermally coupled to the vapor chamber. The at least one hard disk drive is located in the at least one cooling space, and is thermally coupled to one of the plurality of thermally conductive structures.
Claims10
An electronic device, comprising:
- a cooling assembly, comprising:
- a vapor chamber;
- and
- a plurality of thermally conductive structures, arranged side by side on two opposite sides of the vapor chamber to form at least one cooling space, and the plurality of thermally conductive structures are thermally coupled to the vapor chamber;
- and
- at least one hard disk drive, located in the at least one cooling space and thermally coupled to one of the plurality of thermally conductive structures.
A cooling assembly, configured for at least one hard disk drive to be disposed, comprising:
- a vapor chamber;
- and
- a plurality of thermally conductive structures, arranged side by side on two opposite sides of the vapor chamber to form at least one cooling space, the plurality of thermally conductive structures are thermally coupled to the vapor chamber, and the at least one cooling space is configured for the at least one hard disk drive to be thermally coupled to one of the plurality of thermally conductive structures.
Dependencies are inferred from the claim text.