Cooling apparatus for multi-chip/multi-module heat dissipation

A cooling apparatus for multi-chip/multi-module heat dissipation, the cooling apparatus being placed in a chassis, and the chassis comprising a case and a plurality of computing modules disposed in the case, wherein the cooling apparatus comprises:

• a plurality of liquid cooling assemblies, each liquid cooling assembly comprising a heat exchange unit, a liquid inlet pipe, and a liquid outlet pipe, the heat exchange unit covering a corresponding computing module to exchange heat with the corresponding computing module, the liquid inlet pipe being connected to the heat exchange unit to supply a low-temperature cooling liquid to the heat exchange unit, and the liquid outlet pipe being connected to the heat exchange unit to return a heated cooling liquid;
• a first liquid distributor disposed on the case and connected to the liquid inlet pipe of each of the plurality of liquid cooling assemblies to supply the low-temperature cooling liquid;
• and
• a second liquid distributor disposed on the case and connected to the liquid outlet pipe of each of the plurality of liquid cooling assemblies to collect the heated cooling liquid.

A chassis, comprising:

• a case;
• a plurality of computing modules disposed in the case;
• and
• a cooling apparatus comprising:
• a plurality of liquid cooling assemblies, each liquid cooling assembly comprising a heat exchange unit, a liquid inlet pipe, and a liquid outlet pipe, the heat exchange unit covering a corresponding computing module to exchange heat with the corresponding computing module, the liquid inlet pipe being connected to the heat exchange unit to supply a low-temperature cooling liquid to the heat exchange unit, and the liquid outlet pipe being connected to the heat exchange unit to return a heated cooling liquid;
• a first liquid distributor disposed on the case and connected to the liquid inlet pipe of each of the plurality of liquid cooling assemblies to supply the low-temperature cooling liquid;
• and
• a second liquid distributor disposed on the case and connected to the liquid outlet pipe of each of the plurality of liquid cooling assemblies to collect the heated cooling liquid.