Coldplate for liquid cooling of an electronic component

A coldplate apparatus for performing thermal management of a pluggable electronic component comprising:

• a body having a top structure and a sidewall, wherein the top structure and the sidewall form a receiving channel configured to be disposed over at least three sides of a cage that is configured to receive the pluggable electronic component;
• wherein the sidewall of the body includes a first opening, a second opening, and a sidewall conduit that is configured to allow liquid to flow between the first opening and the second opening;
• and
• wherein the top structure includes a plurality of topside conduits that are configured to allow liquid to flow between the first opening and the second opening.

A network interface card comprising:

• a circuit board;
• a serial bus interface coupled to the circuit board;
• a cage attached to the circuit board and configured to receive a pluggable electronic component;
• a coldplate including a body having a rectangular top structure and a sidewall extending down from three edges of the top structure, wherein the top structure and the sidewall form a receiving channel to couple with the cage;
• wherein the sidewall of the body includes a first opening, a second opening, and a sidewall conduit that is configured to allow liquid to flow between the first opening and the second opening;
• and
• wherein the top structure includes a plurality of topside conduits that are configured to allow liquid to flow between the first opening and the second opening.