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US 2026/0282269 A1Published application
Airflow guide thermal pad for flex cooling
AssigneeLenovo (United States) Inc.
InventorsHao-Yu Wang, Yuki Saigusa, Akinori Uchino, Masahiro Kitamura, Takuroh Kamimura
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Abstract
A computing device includes: a chassis; a heat generating element connected to a substrate within the chassis; and a heat management system configured to cool the heat generating element. The heat management system includes: a heat conductor that is thermally connected to the heat generating element; two fans configured to discharge air across the heat conductor; and an airflow guide disposed between the two fans in a width direction of the chassis. The airflow guide thermally connects the heat conductor to the chassis.
Claims11
A computing device comprising:
- a chassis;
- a heat generating element connected to a substrate within the chassis;
- a heat management system, configured to cool the heat generating element, that includes:
- a heat conductor that is thermally connected to the heat generating element;
- two fans configured to discharge air across the heat conductor;
- and
- an airflow guide disposed between the two fans in a width direction of the chassis,
- wherein the airflow guide thermally connects the heat conductor to the chassis.
5 more elements
Dependencies are inferred from the claim text.