Core modules and earphones
AssigneeShenzhen Shokz Co., Ltd.
InventorsHaofeng ZHANG, Yongjian LI, Jiang XU, Duoduo WU
Life of this patent
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Abstract
Provided are a core module and an earphone. The core module may include a core housing, and a speaker and a bracket provided in the core housing. The bracket and the speaker may enclose to form an acoustic cavity, the core housing may be provided with an acoustic hole, the bracket may be provided with an acoustic channel connecting the acoustic hole and the acoustic cavity, the bracket may cooperate with the core housing to form a first adhesive-containing groove surrounding at least a portion of the acoustic hole, and the first adhesive-containing groove may contain a first adhesive for sealing an assembly gap between the bracket and the core housing.
Claims20
A core module, comprising a core housing, and a speaker and a bracket provided in the core housing, wherein
- the bracket and the speaker enclose to form an acoustic cavity,
- the core housing is provided with an acoustic hole,
- the bracket is provided with an acoustic channel connecting the acoustic hole and the acoustic cavity,
- the speaker includes a body and an annular supporting terrace provided along a circumferential direction of the body,
- a lower end of the bracket is supported on the annular supporting terrace, and
- the acoustic channel is configured open on a side facing the annular supporting terrace.
Dependencies are inferred from the claim text.