US 2026/0280526 A1 · RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE

Abstract

A radio-frequency module includes a module substrate having a major surface, an acoustic wave filter disposed on the major surface, and a first electronic component disposed on the major surface. A bonding wire connects the major surface to the first electronic component. A first sealing member encapsulates the first electronic component and the bonding wire 96 but is spaced from the acoustic wave filter. A laminate resin layer has opposite second and third major surfaces, the second major surface 81a being in contact with the major surface, the sealing member, and the acoustic wave filter. A second sealing member contacts with the third major surface and differs in material property from the laminate resin layer and the sealing member.

Claims18

Dependent claims

A radio-frequency module comprising:

a module substrate having a first major surface;
a first acoustic wave filter disposed on the first major surface;
a first electronic component disposed on the first major surface;
a bonding wire connecting the first major surface to the first electronic component;
a first sealing member encapsulating the first electronic component and the bonding wire and being spaced from the first acoustic wave filter;
a laminate resin layer having a second major surface and a third major surface that are opposite surfaces, the second major surface being in contact with the first major surface, the first sealing member, and the first acoustic wave filter;
and
a second sealing member disposed in contact with the third major surface, the second sealing member differing in material property from the laminate resin layer and the first sealing member.

5 more elements

Dependencies are inferred from the claim text.

Radio-frequency module and communication device

Life of this patent

Radio-frequency module and communication device

Life of this patent

Abstract

Claims18