Acoustic device packaging structure

A power amplifier duplexer module comprising:

• a radio frequency filter packaging structure, the radio frequency filter packaging structure including:
• a substrate having a first surface and a second surface,
• a plurality of signal pads disposed on the first surface, the signal pads including a first signal pad positioned near a first side of the substrate, a second signal pad positioned near a second side of the substrate located away from the first side, a third signal pad positioned near a third side of the substrate, and a fourth signal pad positioned near a fourth side of the substrate located away from the third side,
• at least one first elongated ground pad disposed on the first surface and positioned between the first signal pad and the second signal pad,
• at least one second elongated ground pad disposed on the first surface and positioned between the third signal pad and the fourth signal pad, and
• a ground connection via which the first and second elongated ground pads electrically connected to a ground;
• a transmitter component connected to the first signal pad;
• a receiver component connected to the second signal pad;
• a first antenna connected to the third signal pad;
• and
• a second antenna connected to the fourth signal pad.

A radio frequency device comprising:

• a first transmit-receive pad pair including a first transmit signal pad and a first receive signal pad;
• a second transmit-receive pad pair including a second transmit signal pad and a second receive signal pad;
• and
• a ground pad structure including a first portion having a first ground pad, a second ground pad, and a conductive bar extending between the first ground pad and the second ground pad, the first portion positioned between the first transmit signal pad and a first receive signal pad.