Planar solid state power amplifier architecture with integrated waveguide transitions, heat sink and combiner

A method for amplifying a radio frequency (RF) signal, the method comprising:

• providing a planar dielectric substrate comprising a metallized top side and a metallized bottom side;
• with a first hollow conductive slot, forming an input substrate waveguide between the metallized top side and the metallized bottom side;
• with a first substrate-integrated waveguide (SIW), forming an N-way splitter located after the first conductive slot;
• providing N power amplifiers located after the splitter;
• with a second SIW located after the N power amplifiers, forming an N-way combiner;
• with a second hollow conductive slot located after the N-way combiner, forming an output substrate waveguide between the metallized top side and the metallized bottom side;
• providing a heat sink comprising:
• an input socket;
• a heat sink input waveguide aligned with the input socket and the input substrate waveguide;
• an output socket;
• a heat sink output waveguide aligned with the output socket and the output substrate waveguide;
• receiving the RF signal via the input socket, heat sink input waveguide, and the input substrate waveguide;
• amplifying the RF signal using the N-way splitter, the N power amplifiers, and the N-way combiner to generate an amplified RF signal;
• and
• transmitting the amplified RF signal through the output substrate waveguide, heat sink output waveguide, and output socket.

A wireless device comprising:

• an amplification device comprising:
• a planar dielectric substrate comprising:
• a metallized top side;
• a metallized bottom side;
• a first hollow conductive slot forming an input substrate waveguide between the metallized top side and the metallized bottom side;
• a first substrate-integrated waveguide (SIW) forming an N-way splitter located after the first conductive slot;
• N power amplifiers located after the splitter;
• a second SIW located after the N power amplifiers and forming an N-way combiner;
• and
• a second hollow conductive slot located after the N-way combiner and forming an output substrate waveguide between the metallized top side and the metallized bottom side;
• a heat sink comprising:
• an input socket;
• a heat sink input waveguide aligned with the input socket and the input substrate waveguide;
• an output socket;
• and
• a heat sink output waveguide aligned with the output socket and the output substrate waveguide.