Heat management of semiconductor devices using substantially two-dimensional materials

An array of heat-managed (HM) devices comprising:

• an array of a plurality of semiconductor devices, wherein operation of a semiconductor device of the plurality of semiconductor devices generates heat, wherein the semiconductor device has a film of a thermally conductive material disposed at least on a perimeter of the semiconductor device and directly in thermal communication with semiconductor material of the semiconductor device, wherein the thermally conductive material is characterized by an in-plane thermal conductivity coefficient and an out-of-plane thermal conductivity coefficient and the out-of-plane thermal conductivity coefficient is less than the in-plane thermal conductivity coefficient.

A method for fabricating a heat-managed (HM) device, the method comprising:

• fabricating one or more semiconductor components of a semiconductor device, wherein fabricating the one or more semiconductor components of the semiconductor device comprises defining a perimeter of the semiconductor device;
• and
• transferring or depositing a film of thermally conductive material onto the perimeter of the semiconductor device, wherein the thermally conductive material is characterized by an in-plane thermal conductivity coefficient and an out-of-plane thermal conductivity coefficient and the out-of-plane thermal conductivity coefficient is less than the in-plane thermal conductivity coefficient.