Coil structure and method for manufacturing same, multilayer substrate circuit using coil structure, magnetic device, and copper foil with resin for coil structure

Abstract

To provide a coil structure, a multilayer circuit board, and a magnetic device which achieve excellent dielectric strength characteristics and low inter-coil capacitance without using glass cloth. The coil structure C has coil patterns 21, 22, and 23, which are plate-like conductors wound on a plane, and an insulating material 1 insulating between the coil patterns 21, 22, and 23. The coil patterns 21, 22, and 23 and the insulating material 1 are alternately laminated. The insulating material 1 is a cured product of an insulating resin composition not containing glass cloth. The multilayer circuit board P includes the coil structure C. The magnetic device D is constituted by laminating the coil structure C and a plurality of the multilayer circuit boards P, and mounting a core 4 thereon.

Dependencies are inferred from the claim text.