Interconnect method for memory expansion, scale-up and scale-out of ai/ml systems
AssigneeHuawei Technologies Co., Ltd.
InventorsHamid Mehrvar, Eric Bernier, Yueqi Liang
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AssigneeHuawei Technologies Co., Ltd.
InventorsHamid Mehrvar, Eric Bernier, Yueqi Liang
Estimating the term…
Interconnect systems and methods for processors are provided. A described interconnect system includes a plurality of switches, each of the plurality of switches having a first interface coupled to a respective one of a plurality of I/O interfaces of a processor, and N second interfaces providing selective connectivity between the first interface and N external connections. Some interconnect systems further include plurality of scale-out switches providing selective connectivity between the processor and N planes of inter-rack switching, and an inter-rack switch cluster including the N planes of inter-rack switching. Each plane provides interconnectivity between the processor other processors provided on other racks.
An interconnect system for a processor comprising a plurality of input/output (I/O) interfaces, the interconnect system comprising a plurality of switches, each of the plurality of switches having a first interface coupled to one of the plurality of I/O interfaces and N second interfaces providing selective connectivity between the first interface and N external connections.
An interconnect system for a plurality of processors provided on M racks, the interconnect system comprising:
A method for establishing a connection between a first processor provided on a first rack and a second processor provided on a second rack via an inter-rack switch cluster comprising N planes of inter-rack switching, the method comprising:
Dependencies are inferred from the claim text.