Substrate treatment apparatus and substrate treatment method

Abstract

A substrate treatment apparatus for treating a substrate, includes: a substrate holder configured to hold and rotate a substrate on which a coating film containing metal is formed; a first treatment solution supplier configured to supply a first treatment solution to a front surface of the substrate; a second treatment solution supplier configured to supply a second treatment solution to the front surface of the substrate; a third treatment solution supplier configured to supply a third treatment solution to the front surface of the substrate; and a controller, wherein the controller is configured to execute: a first step of supplying the first treatment solution from the first treatment solution supplier to a first width region from an end portion of the substrate while rotating the substrate to remove the coating film; a second step of supplying, after the first step, the second treatment solution from the second treatment solution supplier to a second width region having a width narrower than the first width region from the end portion of the substrate while rotating the substrate to remove the metal remaining in the second width region; and a third step of supplying, after the second step, the third treatment solution from the third treatment solution supplier to a third width region having a width narrower than the first width region and wider than the second width region from the end portion of the substrate while rotating the substrate to wash away the second treatment solution remaining in the third width region.

Dependencies are inferred from the claim text.