Efficient heat dissipation structure for insertion module

An efficient heat dissipation structure for an insertion module, comprising a first frame component, a first elastic member, and a heat dissipation substrate, wherein the first frame component comprises a first frame and a first connector;

• the first frame is configured to accommodate a first insertion module, the first frame comprises a first top surface, a first bottom surface, and a first rear side surface, the first top surface and the first bottom surface are disposed opposite to each other, and the first rear side surface is located between the first top surface and the first bottom surface;
• the heat dissipation substrate is located below the first bottom surface, and is configured to dissipate heat for the first insertion module by coming into contact with the first bottom surface and/or the first insertion module;
• the first connector is located in a cavity of the first frame close to the first rear side surface, the first connector comprises a first connection end and a second connection end, the first connection end is electrically connected to the second connection end, the second connection end is configured to connect to a first cable, and all signals of the first connector are connected to an external signal through the second connection end and the first cable;
• the first insertion module comprises a first signal end, and when the first signal end is not accurately aligned in a process of being inserted into the first connection end, the first signal end is configured to drive the first connector to float between the first top surface and the first bottom surface;
• and
• the first elastic member is connected to the first top surface, and the first elastic member is configured to:
• after the first insertion module is inserted into the first frame, press the first insertion module toward the first bottom surface under elastic force.