Semiconductor Device and Method of Making a Solder Wall for Photonics Protection
AssigneeSTATS ChipPAC Pte. Ltd.
InventorsYi Xiang Jasper Tay, Swain Hong Alfred Yeo, Chee Meng Law, Junyi Zeng
Life of this patent
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Abstract
A semiconductor device has a build-up interconnect structure with an opening formed through the build-up interconnect structure. A semiconductor die includes a photonic circuit. A solder wall is formed on the semiconductor die around the photonic circuit. The semiconductor die is disposed over the build-up interconnect structure with the photonic circuit aligned to the opening. An underfill or encapsulant is disposed between the build-up interconnect structure and semiconductor die.
Claims25
A method of making a semiconductor device, comprising:
- forming a build-up interconnect structure;
- forming an opening through the build-up interconnect structure;
- providing a semiconductor die including a photonic circuit;
- forming a solder wall on the semiconductor die around the photonic circuit;
- disposing the semiconductor die over the build-up interconnect structure with the photonic circuit aligned to the opening;
- and
- depositing an underfill or encapsulant between the build-up interconnect structure and semiconductor die.
A method of making a semiconductor device, comprising:
- providing a semiconductor die including a photonic circuit;
- forming a solder wall on the semiconductor die around the photonic circuit;
- forming a first conductive layer;
- disposing the semiconductor die over the first conductive layer with the solder wall aligned to a portion of the first conductive layer;
- and
- depositing an underfill or encapsulant over the semiconductor die.
A semiconductor device, comprising:
- a build-up interconnect structure;
- an opening formed through the build-up interconnect structure;
- a semiconductor die disposed over the build-up interconnect structure with a photonic circuit of the semiconductor die aligned to the opening;
- a solder wall disposed between the semiconductor die and build-up interconnect structure around the photonic circuit;
- and
- an underfill or encapsulant deposited between the build-up interconnect structure and semiconductor die.
A semiconductor device, comprising:
- a semiconductor die including a photonic circuit;
- a solder wall formed on the semiconductor die around the photonic circuit;
- a first conductive layer formed over the semiconductor die with a portion of the first conductive layer disposed over the solder wall;
- and
- an underfill or encapsulant disposed over the semiconductor die.
Dependencies are inferred from the claim text.