Integrated optical circuit having switch devices electrically connected by through-substrate via

Abstract

The present disclosure is directed to integrated optical switch circuits and packages. An optical switch circuit includes a substrate having formed thereover a fixed waveguide layer comprising a first bus optical waveguide, a second bus optical waveguide and first bias electrode regions, a suspended waveguide layer formed over the fixed waveguide layer and comprising a first shunt optical waveguide and second bias electrode regions electrically isolated from the first bias electrode regions. The optical switch circuit includes a through-substrate via (TSV) formed through the substrate to electrically connect to the first bias electrode regions, where upon application of a voltage across the first and second bias electrode regions, at least one end region of the first shunt waveguide mechanically bends toward the first bus optical waveguide or the second bus optical waveguide, thereby redirecting light from the first bus optical waveguide to the second bus optical waveguide.

Dependencies are inferred from the claim text.