Semiconductor structure and method for manufacturing the same

A semiconductor structure, comprising:

• a photonic wafer comprising a plurality of photonic integrated circuit (PIC) chips, each PIC chip including a first waveguide;
• an optical interposer on which the photonic wafer is mounted, the optical interposer including a second waveguide;
• a plurality of analog electrical chips, each PIC chip being connected to at least one of the analog electrical chips such that the plurality of analog electrical chips are enabled to optically communicate with each other via the PIC chips and/or the optical interposer;
• and
• a plurality of digital electrical chips, each digital electrical chip being electrically connected to a corresponding analog electrical chip such that the plurality of digital electrical chips are enabled to communicate with each other via the analog electrical chips through the PIC chips and/or the optical interposer;
• wherein, PIC chips arranged in a first direction are optically connected through the first waveguides, and PIC chips arranged in a second direction are optically connected through the second waveguide of the optical interposer, the first direction being different from the second direction.

A method for manufacturing a semiconductor structure, comprising:

• providing a photonic wafer comprising a plurality of photonic integrated circuit (PIC) chips, each PIC chip including a first waveguide;
• providing an optical interposer on which the photonic wafer is disposed, the optical interposer including a second waveguide;
• providing a plurality of analog electrical chips, each PIC chip being connected to at least one of the analog electrical chips such that the plurality of analog electrical chips are enabled to optically communicate with each other via the PIC chips and/or the optical interposer;
• and
• providing a plurality of digital electrical chips, each digital electrical chip being electrically connected to a corresponding analog electrical chip such that the plurality of digital electrical chips are enabled to communicate with each other via the analog electrical chips through the PIC chips and/or the optical interposer;
• wherein, PIC chips arranged in a first direction are optically connected through the first waveguides, and PIC chips arranged in a second direction are optically connected through the second waveguides, the first direction being different from the second direction.